IC Package Mechanical FEA Engineer (R&D)

  • Post category:AI Jobs
  • Post last modified:1 December 2024

Job title: IC Package Mechanical FEA Engineer (R&D)

Company: Broadcom

Job description: high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC… records consistent with local law. If you are located outside USA, please be sure to fill out a home address…

Expected salary: $107000 – 190000 per year

Location: Fort Collins, CO

Job date: Fri, 01 Nov 2024 23:42:02 GMT

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